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6Feb/110

Themis Computer Announces UltraSPARC IIIi based VMEbus Computers

FREMONT, California (PRWEB) June 25, 2003 -

Themis Computer announced its new USPIIIi™, VMEbus computers that incorporate Sun Microsystems UltraSPARC IIIi processors and a new system architecture to provide users with exceptional computing speed, graphics and I/O capabilities. Themis’ new USPIIIi is the industry’s highest performance family of single-processor and dual-processor UltraSPARC®-based VME computers. The new USPIIIi architecture delivers the industry’s best data bandwidth, providing next generation I/O performance for government, industrial, military, and commercial VME embedded processing applications.

The USPIIIi is a multi-slot VME board assembly that implements a dual SMP UltraSPARC IIIi architecture. Based a Sun workstation platform, modified by Themis, the USPIIIi is a next generation solution for demanding new applications and is ideal for use as an upgraded replacement of earlier USP-2™ SMP VME products. The USPIIIi may be configured with either one or two UltraSPARC IIIi CPUs.

The single CPU configuration consists of an I/O board and a CPU board assembly occupying two VME slots. An additional processor board is available as an ordering option; it connects to the first CPU board via the UltraSPARC IIIi processor local bus. A dual-CPU configuration occupies three VME slots. Although the I/O board includes a rich complement of I/O functionality, up to two additional 6U VME I/O boards may be configured with the base I/O board. These additional boards can be PMC carriers (two different options) or TGA3D+™ graphics boards.

Like its USP-2 predecessor, the USPIIIi provides excellent graphics support with Sun technology. The USPIIIi’s optional Themis TGA3D+ graphics adapter incorporates Sun XVR-500 graphics technologies and Solaris™ Operating Environment support. Each UltraSPARC IIIi CPU has a local SMP readable memory module. A dual CPU configuration can have up to 8-GB total memory. True SMP is maintained since each UltraSPARC IIIi CPU can access memory from the other CPU via the high-performance J-Bus. To provide CPU connection to I/O devices, two J-Bus bridge chips are used. Data-flow bottlenecks are minimized since each J-Bus device provides two separate and independent PCI buses. One of the J-Bus bridge devices connects to high-speed I/O devices such as Fibre Channel Arbitrated Loop (FC-AL), SCSI disk drive and Gigabit Ethernet. The other J-Bus bridge connects to a 64-bit/66-MHz PCI trunk for the local PMC connection and for PCI expansion to adjacent VME I/O cards (e.g. - optional PMC carrier, PMC/IO carrier and/or TGA3D+ graphics boards). An Ultra160 SCSI interface is used to support the increased bandwidth of today's high-performance LVD SCSI devices; while automatic backward-compatibility modes protect your investment by assuring that earlier single-ended SCSI devices will continue to function properly. Serial ports, SCSI port A, and keyboard/mouse I/O are available at the VME P2 user defined pins via an optional P2 interface adapter.

"I am pleased to announce a new generation of UltraSPARC VMEbus computers that provide outstanding performance and exceptional reliability for mission-critical applications," said William Kehret, president of Themis Computer. “Our new USPIIIi VMEbus computers demonstrate Themis Computers’ commitment to building the highest performance, rugged VME computers in the industry.”

Base Feature Summary

• One or two UltraSPARC IIIi Processors

• SPECint2k peak 605 (estimate)

• SPECfp2k peak 820 (estimate)

• Up to 8-GB of 266DDR SDRAM Memory (4-GB per processor)

• L2 Cache – 1-MB (on-chip)

• 2-MB Boot Flash and 8-MB User Flash

• VME Interface – VME64x via Tundra Universe II A24/D16, A32/D32 modes

• One (1) 10/100/1000 Mb Ethernet

• Four (4) Serial Ports

• PS/2 or USB KB & Mouse

• Dual Ultra160 SCSI Interface

• Dual Fibre Channel Interface

• One (1) PMC slot (64/32-bit @ 66-MHz)

• PMC expansion – three (3) extra PMC slots or two (2) extra slots plus additional I/O (Serial port, Ethernet)

• System Bus – J-Bus: 128-bit @ 200-MHz

• Optional TGA3D+ graphics - incorporates Sun XVR-500 graphics technologies

• VME64x Injector/Ejector Handles (traditional VME ejectors available)

• SNMP Compatible Environmental Monitor (Voltage, Temp)

• System and User Front Panel LEDs

• 64-bit Solaris 8 and 9 Operating Environment Support for superior scalability

The USPIIIi runs the Solaris 8 and Solaris 9 Operating Environments. The USPIIIi can also run 64-bit applications unmodified from the Solaris 7 Operating Environment, as well as 32-bit applications from previous versions of the Solaris Operating Environment, making these systems compatible with previous systems and software.

The USPIIIi VMEbus computers reflect Themis Computer's extensive experience designing rugged, high performance aerospace and military systems. To ensure reliable operation in extended operating environments, the USPIIIi is designed to withstand shock loads of up to 30G @ 40 msec and operate in ambient temperatures to 50°C.

Themis Computer’s Environmentally Robust Servers and Single-Board Computers

Themis Computer is a leading provider of embedded computers for mission critical applications. Themis' enterprise class servers feature rugged construction, high performance, superior scalability and ease of maintenance. Themis offers a broad range of compact, multi-vendor servers, including dual and four-way SMP platforms.

Themis is committed to providing the broadest range of high performance VME and Compact PCI single board computers for the embedded market. The family comprises the new USPIIe-USB™, the USPIIe-cPCI™, and TGA3D+™ graphics card.

Themis Computer's high performance servers and single-board computers are now being integrated into new communications and defense systems worldwide.

Availability

The Themis Computer USPIIIi will be available 30 days after receipt of order.

About Themis Computer

Themis Computer is a leading developer and supplier of high performance VME and Compact PCI single-board computers, for mission-critical telecommunications, military/aerospace, and industrial applications. The company also provides ruggedized system solutions based on VMEbus, cPCI and COTS motherboards. Themis' open standards-based embedded computing platforms support Solaris™, Linux®, and Windows® NT operating systems. Themis' products incorporate features designed to ensure high reliability and availability while reducing the risks of failure caused by environmental extremes. An ISO 9001 certified company, Themis Computer practices Total Quality Management (TQM) in all areas of its business, from engineering and manufacturing to customer service. Themis Computer is headquartered in Fremont California and offers worldwide service and support. For more information please visit www.themis.com&gt" onclick="linkClick(this.href)">http://www.themis.com">www.themis.com> or email: info@themis.com.

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Themis, the Themis logo, USPIIIi, USP-2, USPIIe-USB, USPIIe-cPCI, and TGA3D+ are trademarks or registered trademarks of Themis Computer. Sun, Sun Microsystems, and Solaris are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. UltraSPARC and SPARC trademarks are used under license and are trademarks or registered trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc. All other trademarks are trademarks of their respective companies.



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